1. Integrated modular design, easy maintenance, compact size.
2. Material environmental protection, in line with ROHS standards.
3. It belongs to cold light source and has little heat effect on processing. It is suitable for deep processing of sensitive materials.
4. The smallest spot diameter can reach 15UM, which is suitable for thin slice micro-hole drilling.
5. Laser maintenance-free for 20000hours, no consumables, power saving and energy saving.
6. Convenient data processing with dedicated laser marking software. Interface is simple and friendly, easy operation.
7. With narrower pulse width and higher peak power.
8. It has good processing effect, fast marking speed, and can realize ultra-fine laser marking.
It is mainly used in the high-end market of ultra-fine processing. The surface marking of packaging bottles of cosmetics, medicines, ornaments and other polymer materials is fine, clear and firm, better than ink printing and pollution-free.
It is also suitable for marking and scribing of flexible PCB, silicon wafer microhole, blind hole processing, LCD glass QRcode marking, glass surface drilling, metal surface coating marking, plastic keys, electronic components, gifts, communication equipment, building materials.