特征:
1. 皮秒激光设备同纳秒激光设备相比，相对的热影响区域大大减小，更有利于精密加工。
2. 加工表面更加光滑。
3. 除了电路板加工以外，皮秒设备也可以加工陶瓷，硅片，铁氟龙等材料
Characteristics:
1. Compared to nano laser equipment, pico laser significantly reduces the heat effected area, which is better for precision processing.
2. The processing surface is smoother.
3. Apart from PCB processing, pico equipment can also be used in ceramic, silicon, teflon, etc.
规格：
|
规格 Specification |
|
|
激光类型Laser Type |
UV Pico Laser / 255nm |
|
平均输出功率Avg. Out Power |
>15w@200 KHz |
|
扫描范围和方法 Scan Scope & Method |
Advanced 2D on the fly |
|
X-Y平台 X-Y stage |
分开的平台，无芯线性驱动 Split Stage, Coreless Linear Motor |
|
面板尺寸 Panel Size |
650mm X 650mm |
|
切割精度Cutting Accuracy |
±10μm @avg |
|
装载机Loader/Un-Loader |
附加选项（片对片 & 卷对卷） Additional Option (Sheet to Sheet & Roll to Roll |
|
电力供应 Electric Power |
220V, 3-phase, 50/60 Hz |
加工效果 Effects:
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